Siyakwamukela kumawebhusayithi ethu!

Izigaba kanye nezicelo ze-Magnetron Sputtering Target

  1. Indlela ye-Magnetron sputtering:

I-Magnetron sputtering ingahlukaniswa ibe i-DC sputtering, i-medium frequency sputtering kanye ne-RF sputtering.

Ugesi we-A. DC sputtering ushibhile futhi ukuminyana kwefilimu efakiwe akulungile.Ngokuvamile, amabhethri afuywayo e-photothermal namafilimu amancane asetshenziswa ngamandla aphansi, kanti okuhlosiwe okuhloswe ngakho kuyithagethi yensimbi eqhubayo.

B. Amandla e-RF sputtering aphakeme, futhi okuhloswe ukuqhumisa kungase kube ithagethi engaconductive noma i-conductive target.

C. Ithagethi ye-sputtering yefrikhwensi emaphakathi ingaba ithagethi ye-ceramic noma ithagethi yensimbi.

  2. Ukuhlelwa kanye nokusetshenziswa kokuhlosiwe kwe-sputtering

Kunezinhlobo eziningi zokuhloswe nge-sputtering, nezindlela zokuhlukanisa okuhlosiwe nazo zihlukile.Ngokusho komumo, zihlukaniswe zibe yithagethi ende, inhloso yesikwele kanye nethagethi eyindilinga;Ngokusho kokwakheka, ingahlukaniswa ngethagethi yensimbi, i-alloy target kanye ne-ceramic compound target;Ngokwezinkambu ezihlukene zohlelo lokusebenza, ingahlukaniswa ibe okuhlosiwe okuhlobene ne-semiconductor ye-ceramic, okuhloswe ukuqopha okuphakathi kwe-ceramic, okuhlosiwe kwe-ceramic, njll. Okuhlosiwe kwe-sputtering kusetshenziswa ikakhulukazi ezimbonini ze-elekthronikhi nezolwazi, ezifana nemboni yokugcina ulwazi.Kulo mkhakha, okuhloswe ukuhlahlela kusetshenziselwa ukulungisa imikhiqizo yefilimu emincane efanele (i-hard disk, ikhanda lamagnetic, i-optical disc, njll.).Okwamanje.Ngokuthuthuka okuqhubekayo kwemboni yolwazi, isidingo sokuqopha okuhlosiwe kwe-ceramic emaphakathi siyakhula.Ucwaningo nokukhiqizwa kokuhlosiwe okuphakathi nendawo sekuyinto okugxilwe kuyo kakhulu.


Isikhathi sokuthumela: May-11-2022