Inqubo Yokubopha Esemuva:
1. Kuyini ukubopha okubophayo?Kubhekiselwa ekusebenziseni i-solder ukushisela into eqondiwe ekubhekiseni emuva.Kunezindlela ezintathu eziyinhloko: i-crimping, i-brazing, ne-adhesive conductive.Ukubophezela okuqondisiwe kuvame ukusetshenziselwa ukubhula, futhi izinto zokubhraza ngokuvamile zihlanganisa u-In, Sn, kanye no-In Sn.Ngokujwayelekile, lapho kusetshenziswa izinto ezithambile zokubhula, amandla okufafaza adingeka abe ngaphansi kuka-20W/cm2.
2, Kungani ubophezela 1. Vimbela ukuhlukana okungalingani kwezinto ezihlosiwe ngesikhathi sokushisisa, okuhloswe ukuphuka okufana ne-ITO, i-SiO2, i-ceramics, ne-sintered targets;2. Londoloza * * * futhi uvimbele ukuwohloka.Uma into ehlosiwe ibiza kakhulu, ingenziwa ibe mncane futhi iboshwe emuva ukuze kuvinjelwe ukuwohloka.
3, Ukukhethwa kwethagethi yasemuva: 1. I-Rich Special Materials Co., Ltd. ivamise ukusebenzisa ithusi elingenawo umoya-mpilo eline-conductivity enhle, futhi ukuhanjiswa okushisayo kwethusi elingenawo umoya-mpilo kungcono kunethusi elibomvu;2. Ugqinsi lumaphakathi, futhi kuvame ukutuswa ukuthi kube nogqinsi olubhekiswe emuva olucishe lube ngu-3mm.Ijiyile kakhulu, idla amandla kazibuthe;Mncane kakhulu, kulula ukuwohloka.
4, Inqubo yokubopha 1. Phatha ngaphambili ingaphezulu lempahla eqondiwe kanye nethagethi yangemuva ngaphambi kokubopha.2. Beka okokusebenza okuqondiwe kanye nethagethi yasemuva endaweni yokushisa bese ukhuphula izinga lokushisa libe yizinga lokushisa elibophezelayo.3. Yenza ngensimbi into eqondiwe kanye nethagethi yasemuva.4. Bond okokusebenza okuqondiwe kanye nethagethi engemuva.5. Ukupholisa kanye nokucubungula emva kokucubungula.
5, Izinyathelo zokuqapha zokusebenzisa okuhlosiwe okuboshiwe: 1. Izinga lokushisa lokufafaza akufanele libe phezulu kakhulu.2. Umsinga kufanele ukhuliswe kancane kancane.3. Amanzi okupholisa ajikelezayo kufanele abe ngaphansi kuka-35 degrees Celsius.4. Ukuminyana kwethagethi efanele
I-6, Isizathu sokuhlukaniswa kwepuleti elingemuva ukuthi izinga lokushisa lokufafaza liphezulu, futhi okubhekiselwe emuva kuthambekele ekubeni ne-oxidation kanye ne-warping.Into eqondiwe izoqhekeka ngesikhathi sokufafaza kwezinga lokushisa eliphezulu, okubangele ukuthi i-back target ihlukane;2. I-current iphezulu kakhulu futhi ukushisa kushesha kakhulu, okwenza izinga lokushisa libe phezulu kakhulu futhi i-solder incibilike, okuholela ekuthengiseni okungalingani kanye nokuhlukaniswa kwethagethi yangemuva;3. Izinga lokushisa lokuphuma kwamanzi okupholisa ajikelezayo kufanele libe ngaphansi kwama-degrees Celsius angama-35, futhi izinga lokushisa eliphezulu lamanzi ajikelezayo lingabangela ukuchithwa kokushisa okubi kanye nokuhlukana;4. Ubuningi bezinto ezihlosiwe ngokwazo, lapho ukuminyana kwezinto ezihlosiwe kuphezulu kakhulu, akulula ukukhangisa, azikho izikhala, futhi i-back target kulula ukuwa.
Isikhathi sokuthumela: Oct-12-2023